Hierarchical Interconnects for On-Chip Clustering
نویسندگان
چکیده
In the sub-micron technology era, wire delays are becoming much more important than gate delays, making it particularly attractive to go for clustered designs. A common form of clustering adopted in processors is to replace the centralized instruction scheduler with multiple smaller schedulers that work in parallel within a single chip. Studies have found that existing interconnects connecting onchip clusters, as well as proposed instruction distribution algorithms, are not scalable. The objective of this paper is to investigate alternate interconnects (we investigate hierarchical interconnects) that provide scalable performance with increase in on-chip clusters. We also investigate distribution algorithms that are best suited for these interconnects. Experimental results of these new interconnects with appropriate distribution techniques show that they more scalable than the existing techniques. achieve an IPC that is around 15-20% more than the most scalable existing configuration, and is also within 2% of that achieved by a hypothetical ideal processor having a 1-cycle latency crossbar interconnect, irrespective of the number of clusters; confirming their utility and applicability In this paper, we also discuss the many other design advantages that are obtained by the use of hierarchical interconnects.
منابع مشابه
A Hierarchical Hybrid Optical-Electronic Clos Architecture for Network-on-Chip
With more and more processor cores integrated on a chip, Networks-on-chip (NoC) is emerging as a candidate architecture for multiprocessor systems-on-chip (MPSoC). Traditional metallic interconnects have become the bottleneck of NoC due to the limited bandwidth, long delay, and high power consumption. Optical Network-on-Chip (ONoC) can decrease interconnect delay and provide higher bandwidth wi...
متن کاملA Unified RLC Model for High-Speed On-Chip Interconnects
In this paper, we propose a compact on-chip interconnect model for full-chip simulation. The model consists of two components, a quasi-three-dimensional (3-D) capacitance model and an effective loop inductance model. In the capacitance model, we propose a novel concept of effective width ( ) for a 3-D wire, which is derived from an analytical two-dimensional (2-D) model combined with a new anal...
متن کاملGraph Clustering by Hierarchical Singular Value Decomposition with Selectable Range for Number of Clusters Members
Graphs have so many applications in real world problems. When we deal with huge volume of data, analyzing data is difficult or sometimes impossible. In big data problems, clustering data is a useful tool for data analysis. Singular value decomposition(SVD) is one of the best algorithms for clustering graph but we do not have any choice to select the number of clusters and the number of members ...
متن کاملElectrical interconnects revitalized
Models of electrical interconnects, including inductance and skin effect, are reviewed. The models are used for estimating the performance of electrical interconnects, particularly related to delays, data rates, and power consumption for off-chip and on-chip interconnects and for clock distribution. It is demonstrated that correctly utilized, electrical interconnects do not severely limit chip ...
متن کاملOn-chip Global Interconnects for Networking ASICs-white paper
While serial transceivers move data in and out of an ASIC, on-chip global interconnects move data inside the ASIC. These global interconnects include crossbar switches and busses for sharing on-chip resources. To guarantee quality of service, the on-chip global interconnects are often designed to carry several times worth of traffic compared to the serial transceivers. Close to 10 Tb/s is not a...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
عنوان ژورنال:
دوره شماره
صفحات -
تاریخ انتشار 2002